Heat dissipation device

ABSTRACT

A heat dissipation device mounted on a circuit board includes an electronic fan, a fin group connected to the electronic fin, and a guide plate arranged near the connection of the electronic fan and the fin group. Airflow from the electronic fan reaches the fin group and the guide plate. The guide plate can divert the direction of the airflow.

BACKGROUND

1. Technical Field

The present disclosure generally relates to heat dissipation devices and, particularly, to a heat dissipation device mechanism used in an electronic device.

2. Description of Related Art

With the development of the electronic technology, more and more electronic components are arranged in an electronic device, which causes the electronic components to have to deal with substantial heat. If the heat is not quickly dissipated from the electronic components, stable and fast performance of the electronic components will not be sustained. Usually, those skilled in the art install a heat dissipation device on an electronic component to help dissipate the heat of the electronic component. However, decreasing available space in the electronic device limits the number of the heat dissipation device. Therefore, a heat dissipation device with high efficiency is needed.

A commonly used heat dissipation device includes an electronic fan, a heat sink, and a guiding device arranged between the electronic fan and the heat sink. The guiding device includes a guiding pipe and a plurality of guiding sheets received in the guiding pipe. Opposite ends of the guiding pipe communicate with the electronic fan and the heat sink, respectively. Wind created by the electronic fan passes through the guiding device and dissipates the heat of the heat sink. The guiding sheets can disperse the wind in the guiding pipe, which increases the dissipation efficiency. However, the heat dissipation device may only help dissipating the heat of the components facing the heat sink. The components arranged on opposite sides of the heat sink or spaced from the heat sink may not get a good dissipation efficiency.

Therefore, there is room for improvement within the art.

BRIEF DESCRIPTION OF THE DRAWINGS

The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout several views, and all the views are schematic.

FIG. 1 is an assembled, isometric view of an exemplary heat dissipation device as disclosed, including an electronic fan, a fin group, a housing and a guide plate.

FIG. 2 is similar to FIG. 1, but shows a view from another aspect.

FIG. 3 is an isometric view of a guide plate used in the heat dissipation device of FIG. 1.

FIG. 4 shows the heat dissipation device of FIG. 1 mounted on a circuit board.

FIG. 5 shows the guide plate of FIG. 3 latching with a housing used in the heat dissipation device of FIG. 1.

DETAILED DESCRIPTION

Referring to FIG. 1, a heat dissipation device 100 used in a computer and to be arranged on a circuit board 50 (see in FIG. 4) includes an electronic fan 10, a fin group 20, a housing 30, and a guide plate 40. The electronic fan 10 and the fin group 20 are connected to the housing 30. The guide plate 40 is rotatably connected to the housing 30.

Referring to FIG. 2, the fin group 20 includes a support bracket 21 and a plurality of parallel and spaced-apart dissipation fins 23. The dissipation fins 23 define a plurality of air passages (not labeled) between neighboring fins 23 for airflow from the electronic fan 10 to flow therethrough to dissipate heat created by the electronic components to the ambient environment.

The housing 30 includes a top plate 31 and connecting plates 33 extending from opposite edges of the top plate 31. Each connecting plate 33 includes a first connecting portion 331, a second connecting portion 333, and a third connecting portion 335 arranged between the first and second connecting portions 331, 333. Both ends of the first and second connecting portions 331, 333 are spaced from the top plate 31 and define a fixing hole 337. The third connecting portion 335 has an edge 3350 slanted to the top plate 31 and a hook 3351 protruding from the edge 3350. The third connecting portion 335 further defines two connecting holes 3353 at opposite sides of the hook 3351.

Referring to FIGS. 2 and 3, the guide plate 40 has latching blocks 41 for receiving the connecting holes 3353 of the housing 30 at a first edge and a positioning portion 43 at an opposite second edge . The guide plate 40 further defines a latching hole 45 for engaging with the hook 3351 of the housing 30. The latching hole 45 is defined between the latching blocks 41. The guide plate 40 further includes a shaft 47 correspondingly formed with the latching hole 45. The surface of the shaft 47 that is located in the latching hole 45 of the guide plate 40 is curved, which allows the guide plate 40 to smoothly rotate.

Referring to FIGS. 2 through 4, when assembling the heat dissipation device 100 to the circuit board 50, the support bracket 21 is connected to the circuit board 50, and the fin group 20 is fixed to the support bracket 21. One edge of each dissipation fin 23 faces the heat component, such as a central processing unit, therefore, the heat can flow into the air passages between neighboring dissipation fins 23 and be dissipated to the ambient environment. The electronic fan 10 may be connected to the first connecting portion 331 of the housing 30. The first connecting portion 331 and the second connecting portion 333 of the housing 30 are connected to the support bracket 21 of the fin group 20. The connecting plates 33 and the dissipation fins 23 are parallel Thus, wind created by the electronic fan 10 can flow into the air passages between neighboring dissipation fins 23. The hook 3351 of the housing 30 is latched in the latching hole 45 of the guide plate 40, and the guide plate 40 can be rotated relative to the housing around the shaft 47. When the guide plate 40 has been rotated a certain angle, the latching blocks 41 are gradually received in the connecting holes 3353 of the housing 30, respectively. When the guide plate 40 is substantially perpendicular to the connecting plate 33 of the housing 30, the latching blocks 41 are received in the connecting holes 3353 of the housing totally, the guide plate 40 is prevented from rotating.

A heat component 60 may also be arranged on the circuit board 50 and located at a side of the fin group 20, adjacent to one of the end dissipation fins 23, neighboring to one of the connecting plates 33 of the housing 30. If the heat produced by the heat component 60 is small, the single dissipation fin 23 may be enough to effectively dissipate the heat of the heat component 60 <watch your word order>. If not, the single dissipation fin 23 may not help dissipate the heat. The guide plate 40 can be used to dissipate the heat of the heat component 60. The location and inclined angle of the guide plate 40 may be adjusted according to the location of the heat component 60, with the heat component 60 arranged under the guide plate 40. When the electronic fan 10 is turned on, airflow from the electronic fan 10 reaches the fin group 20 and the guide plate 40. The airflow reaching the fin group 20 is capable of helping dissipating heat of the component facing the fin group 20. Therefore, by rotating guide plate 40, the direction of the airflow reaching the guide plate 40 can be diverted or adjusted, and the airflow can reach a heat component 60 located under the guide plate 40 and therefore help dissipating the heat of the heat component 60. Thus, the heat dissipation device 100 may help both the components facing and beside the fin group 20 to dissipate heat.

The guide plate 40 is rotatably connected to the housing 30, the guide plate 40 may rotate to cover the connecting plate 33 of the housing 30 and be positioned by the positioning portion 43 of the guide plate 40 to latch with the edge of the second connecting portion 333 of the housing 30 (see in FIG. 5). Thus, less space is occupied.

Finally, while various exemplary embodiments have been described and illustrated, the disclosure is not to be construed as being limited thereto. Various modifications can be made to the exemplary embodiments by those skilled in the art without departing from the true spirit and scope of the disclosure as defined by the appended claims. 

1. A heat dissipation device, comprising: an electronic fan; a fin group connected to the electronic fan; and a guide plate arranged near the connection of the electronic fan and the fin group, airflow from the electronic fan reaches the fin group and the guide plate, and the guide plate can divert the direction of the airflow.
 2. The heat dissipation device of claim 1, further comprising a housing connected to the electronic fan and the fin group.
 3. The heat dissipation device of claim 2, wherein the fin group comprises a support bracket and a plurality of dissipation fins perpendicular to the support bracket.
 4. The heat dissipation device of claim 3, wherein the dissipation fins are parallel to each other.
 5. The heat dissipation device of claim 4, wherein the housing comprises a top plate and two connecting plates extending from opposite edges thereof; the connecting plates are substantially perpendicular to the top plate and parallel to the dissipation fins.
 6. The heat dissipation device of claim 5, wherein the guide plate is rotatably connected to one of the connecting plates of the housing.
 7. The heat dissipation device of claim 6, wherein the connecting plate of the housing comprises a first connecting portion connected to the electronic fan, a second connecting portion, and a third connecting portion arranged between the first and second connecting portions; the fin group is connected to the first and second connecting portions; the guide plate is rotatably connected to the third connecting portion.
 8. The heat dissipation device of claim 7, wherein the third connecting portion of the housing comprises an inclined edge and a hook protruding from the inclined edge; the guide plate defines a latching hole for engaging the hook.
 9. The heat dissipation device of claim 8, wherein the third connecting portion of the housing further defines two connecting holes arranged opposite sides of the hook; one edge of the guide plate protrudes two latching blocks received in the connecting holes of the housing and arranged at opposite sides of the latching hole of the guide plate.
 10. The heat dissipation device of claim 7, wherein the guide plate further comprises a positioning portion engaging with the first connecting portion of the housing.
 11. A heat dissipation device, comprising: an electric fan and a heat dissipating fan group connected with the fan; an adjustable guide plate; whereby using the guide plate, the electric fan and the fan group can dissipate heat from an electrical component below and an electrical component beside the electric fan the fin group.
 12. The heat dissipation device of claim 11, further comprising a housing connected to the electronic fan and the fin group.
 13. The heat dissipation device of claim 12, wherein the fin group comprises a support bracket and a plurality of dissipation fins perpendicular to the support bracket.
 14. The heat dissipation device of claim 13, wherein the dissipation fins are parallel to each other. 